Agreement to strengthen collaboration in the field of innovative development and manufacturing of electronics
In mid-September, FAU President Joachim Hornegger and Bing-Jean Lee, President of Feng Chia University (FCU) in Taiwan, signed an agreement that aims to strengthen collaboration between the two universities in the field of innovative development and manufacturing of electronics. The plan is to further develop 3D-MID technology, which is used to manufacture three-dimensional printed circuit boards for electrical circuits. The key element of the collaboration is an international production institute in Taiwan where the two universities intend to drive forward development of the technology in partnership with Taiwanese electronics companies.
The pilot institute, which will include a research and exhibition centre, is currently being set up at the Central Taiwan Science Park. It will contain manufacturing systems for electrical circuits, which researchers will use to test methods for manufacturing products. The local and national governments have also expressed interest in the project. The Taichung city government, for example, has offered to provide several million Taiwanese dollars to support Innovation Start-up Taichung, a workshop at FCU on designing manufacturing services.
The agreement also intends to promote an exchange of students in international degree programmes at FAU’s Department of Mechanical engineering and open up the possibility for double degree programmes.
Feng Chia University, originally founded in 1961 as the Feng Chia Engineering and Business School, was made a university in 1980. It currently has over 20,000 students and is divided into eight colleges covering fields such as engineering, social sciences, business studies and management.
Phone: +49 911 530296279